NCN8024R
ATTRIBUTES
Characteristics
Values
ESD protection
Human Body Model (HBM) (Note 1)
Card Pins (Card Interface Pins 9 − 17)
8 kV
2 kV
All Other Pins
Machine Model (MM)
Card Pins (Card Interface Pins 9 − 17)
400 V
150 V
All Other Pins
Moisture sensitivity (Note 2) SOIC−28 and TSSOP−28
Level 3
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS (Note 3)
Rating
DC/DC Converter Power Supply Voltage
Power Supply from Microcontroller Side
External Card Power Supply
Symbol
Value
Unit
V
V
DDP
−0.3 v V
v 5.5
DDP
V
DD
−0.3 v V v 5.5
V
DD
CRD_V
−0.3 v CRD_V v 5.5
V
CC
CC
Charge Pump Output
V
UP
−0.3 v V v 5.5
UP
Digital Input Pins
V
−0.3 v V v V
DD
V
V
in
in
Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)
Smart Card Output Pins
V
out
−0.3 v V v V
out DD
V
out
−0.3 v V v CRD_V
CC
V
out
Thermal Resistance Junction−to−Air
SOIC−28
TSSOP−28
R
q
JA
75
76
°C/W
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
T
−40 to +85
−40 to +125
+125
°C
°C
°C
°C
A
T
J
T
Jmax
T
stg
−65 to + 150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T = +25°C
A
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