NCL30486B
PACKAGE DIMENSIONS
SOIC−9 NB
CASE 751BP
ISSUE A
2X
NOTES:
0.10
C A-B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DE-
TERMINED AT DATUM F.
D
H
A
2X
0.20
C
4 TIPS
0.10 C A-B
F
10
6
E
1
5. DIMENSIONS A AND B ARE TO BE DETERM-
INED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
5
L2
A3
SEATING
PLANE
L
C
0.20
C
9X b
DETAIL A
B
5 TIPS
M
MILLIMETERS
0.25
C A-B D
DIM MIN
MAX
1.75
0.25
0.25
0.51
5.00
4.00
TOP VIEW
A
A1
A3
b
D
E
1.25
0.10
0.17
0.31
4.80
3.80
9X
h
X 45
_
0.10
C
0.10
C
M
e
1.00 BSC
H
h
L
5.80
0.37 REF
0.40
6.20
1.27
A
DETAIL A
e
SIDE VIEW
A1
SEATING
PLANE
L2
M
0.25 BSC
C
0
8
_
_
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
1.00
PITCH
9X
0.58
6.50
1
9X
1.18
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
31
ONSEMI [ ONSEMI ]
