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TDA8950 参数 Datasheet PDF下载

TDA8950图片预览
型号: TDA8950
PDF下载: 下载PDF文件 查看货源
内容描述: 2× 150W的D类功率放大器 [2 X 150 W class-D power amplifier]
分类和应用: 放大器功率放大器
文件页数/大小: 39 页 / 272 K
品牌: NXP [ NXP ]
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TDA8950  
NXP Semiconductors  
2 × 150 W class-D power amplifier  
Table 4.  
Overview of TDA8950 protections  
Protection name Complete  
shutdown  
Restart directly Restart after  
Pin PROT  
detection  
100 ms  
TFB[1]  
OTP  
OCP  
WP  
N
N
N
N
N
Y
N
N
N
N
Y
N
N[2]  
Y
Y[2]  
Y[2]  
N[3]  
Y
Y
N
UVP  
OVP  
UBP  
N
Y
Y
N
Y
Y
N
Y
[1] Amplifier gain will depend on junction temperature and heatsink size.  
[2] Only complete shutdown of amplifier if short-circuit impedance is below threshold of 1 . In all other cases  
current limiting results in clipping of the output signal.  
[3] Fault condition detected during (every) transition between standby-to-mute and during restart after  
activation of OCP (short-circuit to one of the supply lines).  
8.4 Differential audio inputs  
For a high common mode rejection ratio and a maximum of flexibility in the application, the  
audio inputs are fully differential.  
There are two possibilities:  
For stereo operation it is advised to use the inputs in anti phase and also to connect  
the speakers in anti phase (to avoid acoustical phase differences). This construction  
has several advantages:  
The peak current in the power supply is minimized  
The supply pumping effect is minimized, especially at low audio frequencies  
For mono BTL operation it is required that the inputs are connected in anti parallel.  
The output of one of the channels is inverted and the speaker load is now connected  
between the two outputs of the TDA8950. In principle the output power to the speaker  
can be significantly boosted to two times the output power in single ended stereo.  
The input configuration for a mono BTL application is illustrated in Figure 7.  
OUT1  
IN1P  
IN1M  
V
SGND  
in  
IN2P  
IN2M  
OUT2  
power stage  
mbl466  
Fig 7.  
Input configuration for mono BTL application  
Rev. 01 — 9 September 2008  
TDA8950_1  
© NXP B.V. 2008. All rights reserved.  
Preliminary data sheet  
11 of 39  
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