Nexperia
PXP400-100QS
100 V, P-channel Trench MOSFET
13. Soldering
Footprint information for reflow soldering of MLPAK33 package
SOT8002-2
3.55
2.60
2.45
2.35
0.65
2.50 2.40
0.20
3.25 3.80 4.05
0.55
0.55 0.65
0.85 0.75 0.65
0.30
0.40
0.50
0.65
0.15
0.25
recommended stencil thickness: 0.1 mm
occupied area
solder resist
solder paste
solder lands
Dimensions in mm
19-12-20
Issue date
sot8002-2_fr
Fig. 19. Reflow soldering footprint for MLPAK33 (SOT8002-2)
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PXP400-100QS
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Nexperia B.V. 2020. All rights reserved
Product data sheet
7 May 2020
11 / 14
NEXPERIA [ Nexperia ]
