Nexperia
PXP400-100QS
100 V, P-channel Trench MOSFET
12. Package outline
MLPAK33: plastic thermal enhanced surface mounted package; mini leads; 8 terminals;
pitch 0.65 mm; 3.3 x 3.3 x 0.8 mm body
SOT8002-2
X
b
(8x)
v
B
A
C
C
e
(6x)
w
y
C
1
4
K
L
1
(4x)
L
(4x)
2
E
2
8
5
D
2
A
B
A
8
5
θ
E
E
1
E
3
C
c
Seating Plane
1
4
y
C
1
D
1
detail X
5 mm
D
0
scale
Dimensions (mm are the original dimensions)
Unit
A
b
c
D
D
1
D
2
e
E
E
E
E
K
L
L
θ
y
y
1
v
w
1
2
3
1
2
max 0.90 0.35 0.18 3.40 3.20 2.35
3.30
min 0.70 0.25 0.12 3.20 3.10 2.15
3.35 3.10 2.20 0.25
0.65 3.30
0.55 0.50 12°
0.45 0.40 10°
0.35 0.30 8°
0.6
(ref)
0.80 0.30 0.15
3.15 2.25
3.00 2.10 0.20
3.25 2.90 2.00 0.15
nom
mm
0.05 0.05 0.1 0.05
sot8002-2_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
EIAJ
19-12-19
20-01-08
SOT8002-2
Fig. 18. Package outline MLPAK33 (SOT8002-2)
©
PXP400-100QS
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2020. All rights reserved
Product data sheet
7 May 2020
10 / 14
NEXPERIA [ Nexperia ]
