Nexperia
PXN012-60QL
N-channel 60 V, 11.5 mOhm, logic level Trench MOSFET in MLPAK33
11. Package outline
MLPAK33: plastic thermal enhanced surface mounted package; mini leads; 8 terminals;
pitch 0.65 mm; 3.3 x 3.3 x 0.8 mm body
SOT8002-1
X
b
(8x)
v
B
C A
C
e
(6x)
w
y
C
1
4
K
L
1
(4x)
E
2
L
2
8
5
D
2
A
B
A
8
5
θ
E
E
1
E
3
C
c
Seating Plane
1
4
y
C
1
D
1
detail X
5 mm
D
0
scale
Dimensions (mm are the original dimensions)
Unit
A
b
c
D
D
1
D
2
e
E
E
E
E
K
L
1
L
2
θ
y
y
1
v
w
1
2
3
max 0.90 0.35 0.18 3.50 3.25 2.65
3.30
min 0.70 0.25 0.12 3.10 3.05 2.45
3.50 3.10 1.99 0.25
0.40 0.58 12°
0.25 0.43 10°
0.10 0.28 8°
0.65
(ref)
0.65 3.30
0.80 0.30 0.15
3.15 2.55
3.00 1.89 0.20
nom
mm
0.05 0.05 0.1 0.05
3.10 2.90 1.79 0.15
sot8002-1_po
References
Outline
version
European
projection
Issue date
19-12-19
IEC
JEDEC
EIAJ
SOT8002-1
20-01-09
Fig. 16. Package outline MLPAK33 (SOT8002-1)
©
PXN012-60QL
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2021. All rights reserved
Product data sheet
8 July 2021
9 / 12