Nexperia
PXN012-60QL
N-channel 60 V, 11.5 mOhm, logic level Trench MOSFET in MLPAK33
12. Soldering
Footprint information for reflow soldering of MLPAK33 package
SOT8002-1
3.55
2.60
2.45
2.35
0.50
2.68 2.58
0.20
3.25 3.80 4.05
0.70
0.95
0.52 0.62
0.20
0.70 0.60 0.50
0.30
0.40
0.50
0.65
2.65
0.15
0.25
recommended stencil thickness: 0.1 mm
occupied area
solder resist
solder paste
solder lands
Dimensions in mm
19-12-20
Issue date
sot8002-1_fr
Fig. 17. Reflow soldering footprint for MLPAK33 (SOT8002-1)
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PXN012-60QL
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Nexperia B.V. 2021. All rights reserved
Product data sheet
8 July 2021
10 / 12
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