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GRM1882C2A270JA01 参数 Datasheet PDF下载

GRM1882C2A270JA01图片预览
型号: GRM1882C2A270JA01
PDF下载: 下载PDF文件 查看货源
内容描述: [Chip Multilayer Ceramic Capacitors for General Purpose]
分类和应用:
文件页数/大小: 220 页 / 3429 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
sales representatives or product engineers before ordering.  
09.9.18  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
Notice  
Continued from the preceding page.  
7. Coating  
1. A crack may be caused in the capacitor due to the stress  
of the thermal contraction of the resin during curing  
process.  
Select a resin for which the thermal expansion coefficient  
is as close to that of capacitor as possible.  
A silicone resin can be used as an under-coating to buffer  
against the stress.  
The stress is affected by the amount of resin and curing  
contraction.  
2. Select a resin that is less hygroscopic.  
Using hygroscopic resins under high humidity conditions  
may cause the deterioration of the insulation resistance of  
a capacitor.  
Select a resin with small curing contraction.  
The difference in the thermal expansion coefficient  
between a coating resin or a molding resin and capacitor  
may cause the destruction and deterioration of the  
capacitor such as a crack or peeling, and lead to the  
deterioration of insulation resistance or dielectric  
breakdown.  
An epoxy resin can be used as a less hygroscopic resin.  
8. Die Bonding/Wire Bonding (GMA or GMD Series)  
1. Die Bonding of Capacitors  
2. Wire Bonding  
• Use the following materials for the Brazing alloys:  
Au-Sn (80/20) 300 to 320 degree C in N2 atmosphere  
• Mounting  
• Wire  
Gold wire: 25 micro m (0.001 inch) diameter  
• Bonding  
8
(1) Control the temperature of the substrate so it  
matches the temperature of the brazing alloy.  
(2) Place the brazing alloy on the substrate and place  
the capacitor on the alloy. Hold the capacitor and  
gently apply the load. Be sure to complete the  
operation within 1 minute.  
(1) Thermo compression, ultrasonic ball bonding.  
(2) Required stage temperature: 150 to 200 degree C  
(3) Required wedge or capillary weight: 0.2N to 0.5N  
(4) Bond the capacitor and base substrate or other  
devices with gold wire.  
157  
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