• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering0. 9.9.18
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice
Continued from the preceding page.
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of Solderability.
So apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering).
2. Flux containing too a high percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.2%
max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
8
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
A
B
D
Outer Electrode
C
[As Mounted on Substrate]
B
A
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
and condition surely for confirming the quality and select
the applicable solvent.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
2. Unsuitable cleaning solvent may leave residual flux, other
foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
Continued on the following page.
156
MURATA [ muRata ]
