MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21265-P/AP
PS21265-P/AP
TRANSFER-MOLD TYPE
TRANSFER-MOLD TYPE
INSULATED TYPE
INSULATED TYPE
PS21265
INTEGRATED POWER FUNCTIONS
600V/20A low-loss 5
th
generation IGBT inverter bridge for
three phase DC-to-AC power conversion
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
•
•
•
•
•
For upper-leg IGBT
S
:Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection.
For lower-leg IGBT
S
: Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC).
Fault signaling : Corresponding to an SC fault (Lower-side IGBT) or a UV fault (Lower-side supply).
Input interface : 3, 5V line compatible. (High Active)
UL Approved : Yellow Card No. E80276
APPLICATION
AC100V~200V three-phase inverter drive for small power motor control.
Fig. 1 PACKAGE OUTLINES (Short-pin type : PS21265-P)
Refer Fig. 6 for long-pin type : PS21265-AP.
Dimensions in mm
NOTE
27×2.8(=75.6)
2.8
±0.3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15 16 17 18 19 20 21
TERMINAL CODE
D
Heat sink side
Type name , Lot No.
11.5
±0.5
2-φ4.5
±0.2
13.4
±0.5
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
UP
VP1
VUFB
VUFS
VP
VP1
VVFB
VVFS
WP
VP1
VPC
VWFB
VWFS
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
VN1
VNC
CIN
CFO
FO
UN
VN
WN
P
U
V
W
N
21.4
±0.5
34.9
±0.5
31
±0.5
(11.5)
3.8
±0.2
22
23
24
25
26
10
±0.3
10
±0.3
10
±0.3
67
±0.3
79
±0.5
B
20
±0.3
(8.5)
A
28
±0.5
Irregular solder remains
0.5MAX
C
1
±0.2
1
±0.2
0.7
±0.2
0.7
±0.2
0.8
±0.2
Irregular solder remains
0.5MAX
0.8
±0.2
0.45
±0.2
0.8
±0.2
0.45
±0.2
0.45
±0.2
0.6
±0.5
C0
8
±0.5
12.8
±0.5
.2
C
0.
2
(2.5)
(71)
Heat sink side
OTHERS
TERMINAL 22, 26
DETAIL B
(5 pins t = 0.7)
OTHERS
TERMINAL 1-2, 20-21
DETAIL C
(21 pins t = 0.7)
0.5
±0.2
DETAIL A
(0 ~ 5°)
DETAIL D
Note: All outer lead terminals are with Pb-free solder plating.
Oct. 2005
0.6
±0.5
MITSUBISHI [ MITSUBISHI ELECTRIC SEMICONDUCTOR ]
