ProASIC3 DC and Switching Characteristics
Power Consumption of Various Internal Resources
Table 2-14 • Different Components Contributing to Dynamic Power Consumption in ProASIC3 Devices
Device Specific Dynamic Contributions
(µW/MHz)
Parameter
PAC1
Definition
Clock contribution of a Global Rib
Clock contribution of a Global Spine
Clock contribution of a VersaTile row
14.50 12.80 12.80 11.00 11.00 9.30 9.30 9.30
PAC2
2.48 1.85 1.35 1.58 0.81 0.81 0.41 0.41
PAC3
0.81
0.12
PAC4
Clock contribution of a VersaTile used as a
sequential module
PAC5
PAC6
PAC7
First contribution of a VersaTile used as a
sequential module
0.07
0.29
0.29
0.70
Second contribution of a VersaTile used as a
sequential module
Contribution of a VersaTile used as a
combinatorial Module
PAC8
PAC9
Average contribution of a routing net
Contribution of an I/O input pin (standard
dependent)
See Table 2-8 on page 2-7 through
Table 2-10 on page 2-8.
PAC10
PAC11
PAC12
PAC13
Contribution of an I/O output pin (standard
dependent)
See Table 2-11 on page 2-9 through
Table 2-13 on page 2-10.
Average contribution of a RAM block during a
read operation
25.00
30.00
2.60
Average contribution of a RAM block during a
write operation
Dynamic contribution for PLL
Note: *For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi Power
spreadsheet calculator or SmartPower tool in Libero SoC software.
2-11
Revision 18
MICROSEMI [ Microsemi ]
