ProASIC3 Flash Family FPGAs
The absolute maximum junction temperature is 100°C. EQ 1 shows a sample calculation of the absolute maximum
power dissipation allowed for a 484-pin FBGA package at commercial temperature and in still air.
Max. junction temp. (C) – Max. ambient temp. (C) 100C – 70C
·
------------------------------------------------------------------------------------------------------------------------------------------ -------------------------------------
= 1.463 W
Maximum Power Allowed =
=
ja(C/W)
20.5C/W
EQ 1
Table 2-5 • Package Thermal Resistivities
ja
Package Type
Device
Pin Count jc Still Air 200 ft/min
500 ft/min Units
Quad Flat No Lead
A3P030
A3P060
132
132
132
132
100
144
208
144
256
484
144
256
484
0.4
0.3
0.2
0.1
10.0
11.0
8.0
3.8
3.8
3.2
6.3
6.6
8.0
21.4
21.2
21.1
21.0
35.3
33.5
26.1
26.9
26.6
20.5
31.6
28.1
23.3
16.8
16.6
16.5
16.4
29.4
28.0
22.5
22.9
22.8
17.0
26.2
24.4
19.0
15.3
15.0
14.9
14.8
27.1
25.7
20.8
21.5
21.5
15.9
24.2
22.7
16.7
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
A3P125
A3P250
Very Thin Quad Flat Pack (VQFP)
Thin Quad Flat Pack (TQFP)
All devices
All devices
All devices
See note*
See note*
See note*
A3P1000
A3P1000
A3P1000
Plastic Quad Flat Pack (PQFP)
Fine Pitch Ball Grid Array (FBGA)
Note: *This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
Temperature and Voltage Derating Factors
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.425 V)
Junction Temperature (°C)
Array Voltage VCC
(V)
–40°C
0°C
0.93
0.88
0.84
25°C
0.95
0.90
0.87
70°C
1.00
0.95
0.91
85°C
1.02
0.96
0.93
100°C
1.04
1.425
1.500
1.575
0.88
0.83
0.98
0.80
0.94
Revision 18
2-6
MICROSEMI [ Microsemi ]
