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MT47H128M8HV-187EAT 参数 Datasheet PDF下载

MT47H128M8HV-187EAT图片预览
型号: MT47H128M8HV-187EAT
PDF下载: 下载PDF文件 查看货源
内容描述: DDR2 SDRAM [DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 131 页 / 9265 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR2 SDRAM  
List of Figures  
Figure 1: 1Gb DDR2 Part Numbers ................................................................................................................... 3  
Figure 2: Simplified State Diagram ................................................................................................................... 9  
Figure 3: 256 Meg x 4 Functional Block Diagram ............................................................................................. 12  
Figure 4: 128 Meg x 8 Functional Block Diagram ............................................................................................. 13  
Figure 5: 64 Meg x 16 Functional Block Diagram ............................................................................................. 14  
Figure 6: 60-Ball FBGA – x4, x8 Ball Assignments (Top View) ........................................................................... 15  
Figure 7: 84-Ball FBGA – x16 Ball Assignments (Top View) .............................................................................. 16  
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16 ................................................................................... 19  
Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8 ............................................................................... 20  
Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8 ............................................................................................. 21  
Figure 11: Example Temperature Test Point Location ..................................................................................... 24  
Figure 12: Single-Ended Input Signal Levels ................................................................................................... 43  
Figure 13: Differential Input Signal Levels ...................................................................................................... 44  
Figure 14: Differential Output Signal Levels .................................................................................................... 46  
Figure 15: Output Slew Rate Load .................................................................................................................. 47  
Figure 16: Full Strength Pull-Down Characteristics ......................................................................................... 48  
Figure 17: Full Strength Pull-Up Characteristics ............................................................................................. 49  
Figure 18: Reduced Strength Pull-Down Characteristics ................................................................................. 50  
Figure 19: Reduced Strength Pull-Up Characteristics ...................................................................................... 51  
Figure 20: Input Clamp Characteristics .......................................................................................................... 52  
Figure 21: Overshoot ..................................................................................................................................... 53  
Figure 22: Undershoot .................................................................................................................................. 53  
Figure 23: Nominal Slew Rate for tIS .............................................................................................................. 58  
Figure 24: Tangent Line for tIS ....................................................................................................................... 58  
Figure 25: Nominal Slew Rate for tIH .............................................................................................................. 59  
Figure 26: Tangent Line for tIH ...................................................................................................................... 59  
Figure 27: Nominal Slew Rate for tDS ............................................................................................................. 64  
Figure 28: Tangent Line for tDS ...................................................................................................................... 64  
Figure 29: Nominal Slew Rate for tDH ............................................................................................................ 65  
Figure 30: Tangent Line for tDH ..................................................................................................................... 65  
Figure 31: AC Input Test Signal Waveform Command/Address Balls ............................................................... 66  
Figure 32: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential) ........................................... 66  
Figure 33: AC Input Test Signal Waveform for Data with DQS (Single-Ended) .................................................. 67  
Figure 34: AC Input Test Signal Waveform (Differential) ................................................................................. 67  
Figure 35: MR Definition ............................................................................................................................... 75  
Figure 36: CL ................................................................................................................................................ 78  
Figure 37: EMR Definition ............................................................................................................................. 79  
Figure 38: READ Latency ............................................................................................................................... 82  
Figure 39: WRITE Latency ............................................................................................................................. 82  
Figure 40: EMR2 Definition ........................................................................................................................... 83  
Figure 41: EMR3 Definition ........................................................................................................................... 84  
Figure 42: DDR2 Power-Up and Initialization ................................................................................................. 85  
Figure 43: Example: Meeting tRRD (MIN) and tRCD (MIN) .............................................................................. 88  
Figure 44: Multibank Activate Restriction ....................................................................................................... 89  
Figure 45: READ Latency ............................................................................................................................... 91  
Figure 46: Consecutive READ Bursts .............................................................................................................. 92  
Figure 47: Nonconsecutive READ Bursts ........................................................................................................ 93  
Figure 48: READ Interrupted by READ ........................................................................................................... 94  
Figure 49: READ-to-WRITE ............................................................................................................................ 94  
Figure 50: READ-to-PRECHARGE – BL = 4 ...................................................................................................... 95  
PDF: 09005aef821ae8bf  
1GbDDR2.pdf – Rev. T 02/10 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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© 2004 Micron Technology, Inc. All rights reserved.  
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