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MT47H128M8HV-187EAT 参数 Datasheet PDF下载

MT47H128M8HV-187EAT图片预览
型号: MT47H128M8HV-187EAT
PDF下载: 下载PDF文件 查看货源
内容描述: DDR2 SDRAM [DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 131 页 / 9265 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR2 SDRAM  
Input Electrical Characteristics and Operating Conditions  
Table 16: Differential Input Logic Levels  
All voltages referenced to VSS  
Parameter  
Symbol  
VIN(DC)  
VID(DC)  
VID(AC)  
VIX(AC)  
VMP(DC)  
Min  
Max  
VDDQ  
Units Notes  
DC input signal voltage  
–300  
mV  
mV  
mV  
mV  
mV  
1, 6  
2, 6  
3, 6  
4
DC differential input voltage  
AC differential input voltage  
AC differential cross-point voltage  
Input midpoint voltage  
250  
500  
VDDQ  
VDDQ  
0.50 × VDDQ - 175  
850  
0.50 × VDDQ + 175  
950  
5
1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK,  
CK#, DQS, DQS#, LDQS, LDQS#, UDQS, UDQS#, and RDQS, RDQS#.  
Notes:  
2. VID(DC) specifies the input differential voltage |VTR - VCP| required for switching, where  
VTR is the true input (such as CK, DQS, LDQS, UDQS) level and VCP is the complementary  
input (such as CK#, DQS#, LDQS#, UDQS#) level. The minimum value is equal to VIH(DC)  
VIL(DC). Differential input signal levels are shown in Figure 13.  
-
3. VID(AC) specifies the input differential voltage |VTR - VCP| required for switching, where  
VTR is the true input (such as CK, DQS, LDQS, UDQS, RDQS) level and VCP is the comple-  
mentary input (such as CK#, DQS#, LDQS#, UDQS#, RDQS#) level. The minimum value is  
equal to VIH(AC) - VIL(AC), as shown in Table 15 (page 43).  
4. The typical value of VIX(AC) is expected to be about 0.5 × VDDQ of the transmitting device  
and VIX(AC) is expected to track variations in VDDQ. VIX(AC) indicates the voltage at which  
differential input signals must cross, as shown in Figure 13.  
5. VMP(DC) specifies the input differential common mode voltage (VTR + VCP)/2 where VTR is  
the true input (CK, DQS) level and VCP is the complementary input (CK#, DQS#). VMP(DC)  
is expected to be approximately 0.5 × VDDQ  
.
6. VDDQ + 300mV allowed provided 1.9V is not exceeded.  
Figure 13: Differential Input Signal Levels  
1
2.1V  
VIN(DC)max  
VDDQ = 1.8V  
2
CP  
1.075V  
0.9V  
X
5
4
3
VID(DC)  
VIX(AC)  
VMP(DC)  
6
VID(AC)  
0.725V  
X
2
TR  
1
VIN(DC)min  
–0.30V  
1. TR and CP may not be more positive than VDDQ + 0.3V or more negative than VSS - 0.3V.  
Notes:  
2. TR represents the CK, DQS, RDQS, LDQS, and UDQS signals; CP represents CK#, DQS#,  
RDQS#, LDQS#, and UDQS# signals.  
3. This provides a minimum of 850mV to a maximum of 950mV and is expected to be  
VDDQ/2.  
4. TR and CP must cross in this region.  
5. TR and CP must meet at least VID(DC)min when static and is centered around VMP(DC)  
6. TR and CP must have a minimum 500mV peak-to-peak swing.  
.
PDF: 09005aef821ae8bf  
1GbDDR2.pdf – Rev. T 02/10 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
44  
© 2004 Micron Technology, Inc. All rights reserved.  
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