1Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
Table 7: Thermal Impedance
Substrate
θ JA (°C/W)
θ JA (°C/W)
θ JA (°C/W)
Die Revision Package
(pcb)
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
Airflow = 0m/s Airflow = 1m/s Airflow = 2m/s θ JB (°C/W) θ JC (°C/W)
G1
60-ball
84-ball
60-ball
84-ball
66.5
49.2
60.2
44
49.6
40.4
44.5
35.7
55.5
45.7
52.0
42.7
43.1
36.4
39.3
32.8
49.5
42.3
46.5
39.6
30.3
30
5.9
5.6
5.7
5.6
26.1
26.1
35.6
35.2
32.5
32.3
H1
72.5
54.5
68.8
51.3
1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
Note:
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
25
© 2004 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
