1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
0.8 ±0.1
Seating
Plane
A
0.12 A
60X Ø0.45
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball pads.
Ball A1 ID
Ball A1 ID
9
8
7
3
2 1
A
B
C
D
E
F
8 CTR
10 ±0.15
G
H
J
K
L
0.8 TYP
0.8 TYP
1.2 MAX
0.25 MIN
1.0 X 0.73 MAX
exposed
6.4 CTR
gold-plated pad
nonconductive floating pad
8 ±0.15
1. All dimensions are in millimeters.
Note:
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
21
© 2004 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
