1Gb: x4, x8, x16 DDR3 SDRAM
Features
Table 2: Addressing
Parameter
256 Meg x 4
32 Meg x 4 x 8 banks
8K
128 Meg x 8
64 Meg x 16
8 Meg x 16 x 8 banks
8K
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
Page Size
16 Meg x 8 x 8 banks
8K
16K (A[13:0])
8 (BA[2:0])
16K (A[13:0])
8 (BA[2:0])
1K (A[9:0])
1KB
8K (A[12:0])
8 (BA[2:0])
1K (A[9:0])
2KB
2K (A[11, 9:0])
1KB
Figure 1: DDR3 Part Numbers
Example Part Number: MT41J256M4JP-125:G
-
:
MT41J
Configuration
Package
Speed
Revision
:G
Revision
Temperature
Commercial
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
256M4
128M8
64M16
None
Industrial temperature
IT
Automotive temperature
AT
Package
Rev. Mark
Speed Grade
t
78-ball 8mm x 11.5mm FBGA
96-ball 8mm x 14mm FBGA
G
G
JP
JT
-107
CK = 1.07ns, CL = 13
t
-107E
-125
CK = 1.07ns, CL = 12
CK = 1.25ns, CL = 11
CK = 1.25ns, CL = 10
CK = 1.5ns, CL = 9
CK = 1.87ns, CL = 7
t
t
t
t
-125E
-15E
-187E
1. Not all options listed can be combined to define an offered product. Use the part catalog search on
http://www.micron.com for available offerings.
Note:
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
2006 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
