2 MEG x 16
ASYNC/PAGE/BURST FLASH MEMORY
58-BALL FBGA
0.80 0.075
SEATING PLANE
.10 C
C
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .27mm
BALL A8
0.35 TYP
58X
Ø
7.00 0.10
5.25
0.75
TYP
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS Ø 0.33
BALL #1 ID
ENCAPSULATION MATERIAL: EPOXY NOVOLAC
BALL #1 ID
BALL A1
0.75
TYP
6.00 0.05
C
L
12.00 .10
4.50
2.25 0.05
1.50 (4X)
C
L
SUPPORT BALLS
(4X)
1.20 MAX
2.625 0.05 3.50 0.05
NOTE: 1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
DATA SHEET DESIGNATION
No Mark:
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject
to change, as further product development and data characterization sometimes occur.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
2 Meg x 16 Async/Page/Burst Flash Memory
MT28F322D20FH_4.p65 – Rev. 4, Pub. 7/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
43
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