欢迎访问ic37.com |
会员登录 免费注册
发布采购

MT18LD472AG-6 参数 Datasheet PDF下载

MT18LD472AG-6图片预览
型号: MT18LD472AG-6
PDF下载: 下载PDF文件 查看货源
内容描述: 2 , 4梅格X 72无缓冲DIMM的DRAM [2, 4 MEG x 72 NONBUFFERED DRAM DIMMs]
分类和应用: 动态存储器
文件页数/大小: 30 页 / 412 K
品牌: MICRON [ MICRON TECHNOLOGY ]
 浏览型号MT18LD472AG-6的Datasheet PDF文件第1页浏览型号MT18LD472AG-6的Datasheet PDF文件第3页浏览型号MT18LD472AG-6的Datasheet PDF文件第4页浏览型号MT18LD472AG-6的Datasheet PDF文件第5页浏览型号MT18LD472AG-6的Datasheet PDF文件第6页浏览型号MT18LD472AG-6的Datasheet PDF文件第7页浏览型号MT18LD472AG-6的Datasheet PDF文件第8页浏览型号MT18LD472AG-6的Datasheet PDF文件第9页  
OBSOLETE  
2, 4 MEG x 72  
NONBUFFERED DRAM DIMMs  
PART NUMBERS  
EDO PAGE MODE  
EDO Operating Mode  
EDO PAGE MODE, designated by the “Xversion, is an  
accelerated FAST-PAGE-MODEcycle. The primary advan-  
tage of EDO is the availability of data-out even after CAS#  
goes back HIGH. EDO provides for CAS# precharge time  
(tCP) to occur without the output data going invalid. This  
elimination of CAS# output control provides for pipelined  
READs.  
PART NUMBER  
CONFIGURATION  
2 Meg x 72 ECC  
2 Meg x 72 ECC  
4 Meg x 72 ECC  
4 Meg x 72 ECC  
SPEED  
50ns  
60ns  
50ns  
60ns  
MT9LD272AG-5 X  
MT9LD272AG-6 X  
MT18LD472AG-5 X  
MT18LD472AG-6 X  
FAST-PAGE-MODE modules have traditionally turned  
the output buffers off (High-Z) with the rising edge of  
CAS#. EDO-PAGE-MODE DRAMs operate like FAST-  
PAGE-MODE DRAMs, except data will remain valid or  
become valid after CAS# goes HIGH during READs, pro-  
vided RAS# and OE# are held LOW. If OE# is pulsed while  
RAS# and CAS# are LOW, data will toggle from valid data  
to High-Z and back to the same valid data. If OE# is toggled  
or pulsed after CAS# goes HIGH while RAS# remains  
LOW, data will transition to and remain High-Z.  
During an application, if the DQ outputs are wire ORd,  
OE#must be used to disable idle banks ofDRAMs. Alterna-  
tively, pulsing WE# to the idle banks during CAS# HIGH  
time will also High-Z the outputs. Independent of OE#  
control, the outputs will disable after tOFF, which is refer-  
enced from the rising edge of RAS# or CAS#, whichever  
occurs last. (Refer to the 4 Meg x 4 [MT4LC4M4E8] DRAM  
data sheet for additional information on EDO functional-  
ity.)  
FPM Operating Mode  
PART NUMBER  
CONFIGURATION  
2 Meg x 72 ECC  
4 Meg x 72 ECC  
SPEED  
60ns  
MT9LD272AG-6  
MT18LD472AG-6  
60ns  
GENERAL DESCRIPTION  
The MT9LD272A(X) and MT18LD472A(X) are randomly  
accessed 16MB and 32MB memories organized in a x72  
configuration. They are specially processed to operate from  
3V to 3.6V for low-voltage memory systems.  
During READ or WRITE cycles, each bit is uniquely  
addressed through the 21/ 22 address bits, which are en-  
tered 11 bits (A0-A10) at RAS# time and 10/ 11 bits (A0-  
A10) at CAS# time.  
READ and WRITE cycles are selected with the WE#  
input. A logic HIGH on WE# dictates read mode, while a  
logic LOW on WE# dictates write mode. During a WRITE  
cycle, data-in (D) is latched by the falling edge of WE# or  
CAS#, whichever occurs last. An EARLY WRITE occurs  
when WE# is taken LOW prior to CAS# falling. A LATE  
WRITE or READ-MODIFY-WRITE occurs when WE# falls  
after CAS# was taken LOW. During EARLY WRITE cycles,  
the data-outputs (Q) will remain High-Z regardless of the  
state of OE#. During LATE WRITE or READ-MODIFY-  
WRITEcycles,OE#must be taken HIGH to disable the data-  
outputs prior to applying input data. If a LATE WRITE or  
READ-MODIFY-WRITE is attempted while keeping OE#  
LOW, no WRITEwill occur, and the data-outputs will drive  
read data from the accessed location.  
REFRESH  
Returning RAS# and CAS# HIGH terminates a memory  
cycle and decreases chip current to a reduced standby level.  
Also, the chip is preconditioned for the next cycle during  
the RAS# HIGH time. Correct memory cell data is pre-  
served by maintaining power and executing any RAS#  
cycle (READ, WRITE) or RAS# REFRESH cycle (RAS#-  
ONLY, CBR or HIDDEN) so that all combinations of RAS#  
t
addresses (A0-A9/ A10) are executed at least every REF,  
regardless of sequence. The CBR REFRESH cycle will in-  
voke the internal refresh counter for automatic RAS# ad-  
dressing.  
SERIAL PRESENCE-DETECT OPERATION  
This module family incorporates serial presence-detect  
(SPD). The SPD function is implemented using a 2,048-bit  
EEPROM. This nonvolatile storage device contains 256  
bytes. The first 128 bytes can be programmed by Micron to  
identify the module type and various DRAM organizations  
and timing parameters. The remaining 128 bytes of storage  
are available for use by the customer. System READ/  
WRITE operations between the master (system logic) and  
the slave EEPROM device (DIMM) occur via a standard IIC  
bus using the DIMMs SCL (clock) and SDA (data) signals,  
FAST PAGE MODE  
FAST-PAGE-MODE operations allow faster data opera-  
tions (READ or WRITE) within a row-address-defined  
page boundary. The FAST-PAGE-MODE cycle is always  
initiated with a row address strobed in by RAS#, followed  
by a column address strobed in by CAS#. Additional col-  
umns may be accessed by providing valid column  
addresses, strobing CAS# and holding RAS# LOW , thus  
executing faster memory cycles. Returning RAS# HIGH  
terminates the FAST-PAGE-MODE operation.  
2, 4 Meg x 72 Nonbuffered DRAM DIMMs  
DM60.p65 – Rev. 6/98  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
1998, Micron Technology, Inc.  
2
 复制成功!