PIC12(L)F1501
27.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
8-pin PDIP package
TH01
JA
Thermal Resistance Junction to Ambient
89.3
149.5
211
C/W
C/W
C/W
C/W
C/W
C/W
8-pin SOIC package
8-pin MSOP package
56.7
68
8-pin DFN 3X3mm package
8-pin DFN 2X3mm package
TH02
JC
Thermal Resistance Junction to Case
43.1
8-pin PDIP package
39.9
39
C/W
C/W
C/W
C/W
C
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3X3mm package
8-pin DFN 2X3mm package
9
12.7
150
—
TH03
TH04
TH05
TH06
TH07
TJMAX
PD
Maximum Junction Temperature
Power Dissipation
W
PD = PINTERNAL + PI/O
(1)
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD
PI/O
I/O Power Dissipation
Derated Power
—
W
PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
(2)
PDER
—
W
PDER = PDMAX (TJ - TA)/JA
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
DS41615A-page 236
Preliminary
2011 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
