LTC4413
U
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
TYP
6
0.38 ± 0.10
10
0.675 ±0.05
3.50 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 5)
PACKAGE
OUTLINE
(DD10) DFN 0403
5
1
0.25 ± 0.05
0.50 BSC
0.75 ±0.05
0.200 REF
0.25 ± 0.05
0.50
BSC
2.38 ±0.10
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
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2.5µA, 1% Accurate Programmable Battery
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LTC4351
LTC4411
MOSFET Diode-OR Controller
1.2V to 18V Input, Internal Boost Regulator for Driving N-Channel MOSFET
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Load Sharing
LTC4412/LTC4412HV PowerPath Controllers in ThinSOT
More Efficient than Diode ORing, Automatic Switching Between DC Sources,
Simplified Load Sharing, 3V ≤ V ≤ 28V (3V ≤ V ≤ 36V for HV)
IN
IN
ThinSOT is a trademark of Linear Technology Corporation.
4413f
LT/TP 1104 1K • PRINTED IN THE USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
12
●
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(408) 432-1900 FAX: (408) 434-0507 www.linear.com
©LINEAR TECHNOLOGY CORPORATION 2004
Linear [ Linear ]
