LT8705
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE Package
Package Variation: FE38 (31)
38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1665 Rev B)
Exposed Pad Variation AB
4.75 REF
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
REF
38
20
6.60 0.10
4.50 REF
2.74 REF
SEE NOTE 4
6.40
REF (.252)
BSC
2.74
(.108)
0.315 0.05
1.05 0.10
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
PIN NUMBERS 23, 25, 27, 29, 31, 33 AND 35 ARE REMOVED
19
1.20
(.047)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
0.50
(.0196)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
0.17 – 0.27
(.0067 – .0106)
TYP
FE38 (AB) TSSOP REV B 0910
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
2. DIMENSIONS ARE IN
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
8705p
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43
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tionthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
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