LT8705
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-ꢀ70ꢀ Rev C)
0.70 0.05
5.50 0.05
5.ꢀ5 0.05
4.ꢀ0 0.05
3.ꢀ5 0.05
3.00 REF
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
5.5 REF
6.ꢀ0 0.05
7.50 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN ꢀ NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
0.75 0.05
0.00 – 0.05
3.00 REF
5.00 0.ꢀ0
37
38
0.40 0.ꢀ0
PIN ꢀ
TOP MARK
ꢀ
2
(SEE NOTE 6)
5.ꢀ5 0.ꢀ0
5.50 REF
7.00 0.ꢀ0
3.ꢀ5 0.ꢀ0
(UH) QFN REF C ꢀꢀ07
0.200 REF 0.25 0.05
0.50 BSC
R = 0.ꢀ25
TYP
R = 0.ꢀ0
TYP
BOTTOM VIEW—EXPOSED PAD
NOTE:
ꢀ. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
8705p
42
For more information www.linear.com/8705
Linear [ Linear ]
