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ISL88731CHRTZ 参数 Datasheet PDF下载

ISL88731CHRTZ图片预览
型号: ISL88731CHRTZ
PDF下载: 下载PDF文件 查看货源
内容描述: SMBus的Level 2电池充电器 [SMBus Level 2 Battery Charger]
分类和应用: 电池
文件页数/大小: 25 页 / 619 K
品牌: INTERSIL [ Intersil ]
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ISL88731C  
and R are internal divider resistors that set the DC  
Compensation Break Frequency Equations  
4
output voltage. For a 3-cell battery, R = 500kΩ and  
3
1
R = 100kΩ. The following equations relate the  
-----------------------------------------------------------------------  
F
F
F
=
4
(EQ. 23)  
ZERO1  
ZERO2  
(2π ⋅ C  
R  
)
VCOMP  
VCOMP  
compensation network’s poles, zeros and gain to the  
components in Figure 25. Figure 27 shows an asymptotic  
Bode plot of the DC/DC converter’s gain vs. frequency. It  
is strongly recommended that FZERO1 is approximately  
30% of FLC and FZERO2 is approximately 70% of FLC.  
R
R
4
gm1  
5
VCOMP  
-----------------------------------  
--------------------  
------------  
=
2π ⋅ RS2 C  
R
+ R  
3
(EQ. 24)  
(EQ. 25)  
o
4
1
-------------------------------  
=
LC  
(2π L C )  
o
NO BATTERY  
1
------------------------------------------  
=
F
F
(EQ. 26)  
(EQ. 27)  
(EQ. 28)  
FILTER  
(2π ⋅ R C  
)
F2  
F2  
R
BATTERY  
= 200mΩ  
1
----------------------------------------  
=
POLE1  
(2π ⋅ RS2 C )  
o
R
BATTERY  
= 50mΩ  
1
-------------------------------------------  
F
=
ESR  
(2π ⋅ C R  
)
ESR  
o
Choose R  
equal or lower than the value calculated  
from Equation 29.  
VCOMP  
R
+ R  
4
R
4
5
gm1  
3
-----------  
--------------------  
R
= (0.7 F ) ⋅ (2π ⋅ C RS2) ⋅  
VCOMP  
LC  
o
(EQ. 29)  
Next, choose C  
calculated from Equation 30.  
equal or higher than the value  
VCOMP  
1
(EQ. 30)  
--------------------------------------------------------------------------  
C
=
VCOMP  
FREQUENCY (Hz)  
(0.3 F ) ⋅ (2π ⋅ R  
)
VCOMP  
LC  
FIGURE 26. FREQUENCY RESPONSE OF THE LC OUTPUT  
FILTER  
PCB Layout Considerations  
Power and Signal Layers Placement on the  
PCB  
60  
COMPENSATOR  
As a general rule, power layers should be close together,  
either on the top or bottom of the board, with signal  
layers on the opposite side of the board. As an example,  
layer arrangement on a 4-layer board is shown in the  
following:  
MODULATOR  
40  
20  
LOOP  
F
LC  
F
POLE1  
1. Top Layer: signal lines, or half board for signal lines  
and the other half board for power lines  
0
F
FILTER  
2. Signal Ground  
-20  
-40  
-60  
3. Power Layers: Power Ground  
F
ZERO1  
4. Bottom Layer: Power MOSFET, Inductors and other  
Power traces  
F
ZERO2  
F
ESR  
Separate the power voltage and current flowing path  
from the control and logic level signal path. The  
controller IC will stay on the signal layer, which is isolated  
by the signal ground to the power signal traces.  
0.1k  
1k  
10k  
FREQUENCY (Hz)  
100k  
1M  
FIGURE 27. ASYMPTOTIC BODE PLOT OF THE VOLTAGE  
CONTROL LOOP GAIN  
Component Placement  
The power MOSFET should be close to the IC so that the  
gate drive signal, the LGATE, UGATE, PHASE, and BOOT,  
traces can be short.  
Place the components in such a way that the area under  
the IC has less noise traces with high dv/dt and di/dt,  
such as gate signals and phase node signals.  
FN6978.0  
March 8, 2010  
22  
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