28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
2.0
Product Description
This section explains device pin description and package pinouts.
2.1
Package Pinouts
The 3 Volt Advanced Boot Block flash memory is available in 40-lead TSOP (x8, Figure 1),
48-lead TSOP (x16, Figure 2) and 48-ball µBGA(x8 and x16, Figure 3 and Figure 4, respectively)
and 48-ball VF BGA (x16, Figure 4) packages. In all figures, pin changes necessary for density
upgrades have been circled.
Figure 1. 40-Lead TSOP Package for x8 Configurations
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
A17
GND
A20
A19
A10
16 M
8 M
DQ7
DQ6
DQ5
DQ4
VCCQ
VCC
NC
DQ3
DQ2
DQ1
DQ0
OE#
GND
CE#
A0
A8
Advanced Boot Block
40-Lead TSOP
10 mm x 20 mm
WE#
RP#
VPP
WP#
A18
A7
A6
A5
A4
A3
TOP VIEW
4 M
A2
A1
0580_01
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on
Pin 38.
3UHOLPLQDU\
3
INTEL [ INTEL ]
