28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View,
Ball Down)
1
2
3
4
5
6
7
8
16M
A
B
C
D
E
F
A13
A11
A8
VPP
WP#
A19
A7
A4
A14
A10
WE#
A9
RP#
A21
A18
A17
A5
A3
A2
A1
32M
64M
A15
A12
A20
A6
A16
D14
D15
D7
D5
D6
D11
D12
D4
D2
D3
D8
D9
CE#
D0
A0
VCCQ
GND
GND
OE#
D13
VCC
D10
D1
0580_03
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
upper address solder balls. Routing is not recommended in this area. A is the upgrade address for the
19
16-Mbit device. A is the upgrade address for the 32-Mbit device. A is the upgrade address for the 64-Mbit
20
21
device.
2. 4-Mbit density not available in µBGA CSP.
Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6 details the usage of each device
pin.
3UHOLPLQDU\
5
INTEL [ INTEL ]
