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RD28F1602C3B110 参数 Datasheet PDF下载

RD28F1602C3B110图片预览
型号: RD28F1602C3B110
PDF下载: 下载PDF文件 查看货源
内容描述: 3 VOLT英特尔?高级+引导?座闪存?记忆? ( C3) ?堆叠芯片? ScalPackage ? Familye [3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye]
分类和应用: 闪存存储内存集成电路静态存储器
文件页数/大小: 70 页 / 1167 K
品牌: INTEL [ INTEL ]
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3 Volt Intel® Advanced+ Boot Block Flash Memory Stacked-CSP Family  
Table 3. 3 Volt Intel Advanced+ Boot Block Flash Memory Stacked-CSP Bus Operations  
Flash Signals  
SRAM Signals  
Memory Output  
Modes  
Notes  
D –  
0
D
15  
Read  
H
H
H
H
L
L
L
L
H
X
H
X
H
L
Flash  
Flash  
Other  
Other  
Other  
SRAM  
SRAM  
D
2,3,4  
2,4  
5,6  
5,6  
5,6  
2,4  
2,4  
OUT  
SRAM must be in High Z  
Write  
D
IN  
Standby  
Output Disable  
Reset  
H
L
X
H
X
High Z  
High Z  
High Z  
Any SRAM mode is allowable  
X
Read  
L
L
H
H
X
L
L
H
X
X
H
H
L
L
L
D
FLASH must be in High Z  
OUT  
Write  
D
IN  
H
X
L
X
X
H
X
X
X
Standby  
Other  
High Z  
4,5,6  
Any FLASH mode is allowable  
Output Disable  
Data Retention  
H
Other  
Other  
High Z  
High Z  
4,5,6  
4,5,7  
same as a standby  
NOTES:  
1. Two devices may not drive the memory bus at the same time.  
2. The SRAM may be placed into data retention mode by lowering the S-V to the V range, as specified.  
CC  
DR  
2.1.2  
Output Disable  
With F-OE# and S-OE# deasserted, the Stacked-CSP outputs signals are placed in a high-  
impedance state.  
2.1.3  
Standby  
With F-CE# and S-CS1# or S-CS2 deasserted, the Stacked-CSP enters a standby mode, which  
substantially reduces device power consumption. In standby, outputs are placed in a high-  
impedance state independent of F-OE# and S-OE#. If the flash is deselected during a program or  
erase operation, the flash continues to consume active power until the program or erase operation is  
complete.  
12  
Datasheet