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F28F010-90 参数 Datasheet PDF下载

F28F010-90图片预览
型号: F28F010-90
PDF下载: 下载PDF文件 查看货源
内容描述: 1024K ( 128K ×8 )的CMOS FLASH MEMORY [1024K (128K x 8) CMOS FLASH MEMORY]
分类和应用: 闪存存储内存集成电路光电二极管
文件页数/大小: 30 页 / 407 K
品牌: INTEL [ INTEL ]
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28F010  
circuit-board trace inductance, and will supply  
charge to the smaller capacitors as needed.  
DESIGN CONSIDERATIONS  
Two-Line Output Control  
V
Trace on Printed Circuit Boards  
PP  
Flash-memories are often used in larger memory ar-  
rays. Intel provides two read-control inputs to ac-  
commodate multiple memory connections. Two-line  
control provides for:  
Programming flash-memories, while they reside in  
the target system, requires that the printed circuit  
board designer pay attention to the V power sup-  
PP  
ply trace. The V pin supplies the memory cell cur-  
PP  
rent for programming. Use similar trace widths and  
a. the lowest possible memory power dissipation  
and,  
b. complete assurance that output bus contention  
will not occur.  
layout considerations given the V power bus. Ad-  
equate V  
CC  
supply traces and decoupling will de-  
PP  
crease V voltage spikes and overshoots.  
PP  
To efficiently use these two control inputs, an ad-  
dress-decoder output should drive chip-enable,  
while the system’s read signal controls all flash-  
memories and other parallel memories. This assures  
that only enabled memory devices have active out-  
puts, while deselected devices maintain the low  
power standby condition.  
Power Up/Down Protection  
The 28F010 is designed to offer protection against  
accidental erasure or programming during power  
transitions. Upon power-up, the 28F010 is indifferent  
as to which power supply, V or V , powers up  
CC  
PP  
first. Power supply sequencing is not required. Inter-  
nal circuitry in the 28F010 ensures that the com-  
mand register is reset to the read mode on power  
up.  
Power Supply Decoupling  
Flash-memory power-switching characteristics re-  
quire careful device decoupling. System designers  
are interested in three supply current (I ) issuesÐ  
A system designer must guard against active writes  
CC  
for V  
voltages above V  
when V  
Since both WE and CE must be low for a com-  
is active.  
CC  
LKO  
PP  
standby, active, and transient current peaks pro-  
duced by falling and rising edges of chip-enable. The  
capacitive and inductive loads on the device outputs  
determine the magnitudes of these peaks.  
Ý
Ý
mand write, driving either to V will inhibit writes.  
IH  
The control register architecture provides an added  
level of protection since alteration of memory con-  
tents only occurs after successful completion of the  
two-step command sequences.  
Two-line control and proper decoupling capacitor  
selection will suppress transient voltage peaks.  
Each device should have a 0.1 mF ceramic capacitor  
28F010 Power Dissipation  
connected between V and V , and between V  
SS  
CC  
PP  
and V  
.
SS  
When designing portable systems, designers must  
consider battery power consumption not only during  
device operation, but also for data retention during  
system idle time. Flash nonvolatility increases the  
usable battery life of your system because the  
28F010 does not consume any power to retain code  
or data when the system is off. Table 4 illustrates the  
power dissipated when updating the 28F010.  
Place the high-frequency, low-inherent-inductance  
capacitors as close as possible to the devices. Also,  
for every eight devices, a 4.7 mF electrolytic capaci-  
tor should be placed at the array’s power supply  
connection, between V and V . The bulk capaci-  
CC SS  
tor will overcome voltage slumps caused by printed-  
(4)  
Table 4. 28F010 Typical Update Power Dissipation  
Power Dissipation  
(Watt-Seconds)  
Operation  
Notes  
Array Program/Program Verify  
Array Erase/Erase Verify  
One Complete Cycle  
1
2
3
0.171  
0.136  
0.478  
NOTES:  
1. Formula to calculate typical Program/Program Verify Power  
e
typical  
c
Prog Pulses (t  
c
c
c
[
Ý
Ý
V
Ý
Bytes  
typical Prog Pulses (t  
I
PP2  
PP  
WHWH1  
a
c
a
c
c
c
a
typical t  
WHGL  
]
[
V
Ý
typical  
typical .  
t
I
typical)  
Bytes  
I
I
WHGL  
PP4  
CC  
WHWH1  
CC2  
CC4  
]
2. Formula to calculate typical Erase/Erase Verify Power  
e
typical  
c
a
c
c
[
V
(V  
c
typical  
t
typical  
I
typical  
t
WHGL  
PP  
PP3  
ERASE  
PP5  
a
c
a
c
Ý
t
WHGL  
Ý
]
[
V
]
Bytes) .  
Bytes)  
3. One Complete Cycle  
4. ‘‘Typicals’’ are not guaranteed, but based on a limited number of samples from production lots.  
(I  
typical  
e
t
typical  
a
I
CC CC3  
ERASE  
Array Preprogram  
CC5  
Array Erase  
a
Program.  
13  
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