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80523TX233512 参数 Datasheet PDF下载

80523TX233512图片预览
型号: 80523TX233512
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 233MHz, BICMOS, MBGA240]
分类和应用: 信息通信管理外围集成电路
文件页数/大小: 67 页 / 718 K
品牌: INTEL [ INTEL ]
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®
MOBILE PENTIUM PROCESSOR WITH MMX™ TECHNOLOGY  
Table 14. Input and Output Characteristics  
Symbol  
CIN  
Parameter  
Min  
Max  
15  
Unit  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
mA  
mA  
mA  
mA  
Notes  
Input Capacitance  
4
4
4
4
4
4
4
CO  
Output Capacitance  
20  
CI/O  
CCLK  
CTIN  
CTOUT  
CTCK  
ILI  
I/O Capacitance  
25  
CLK Input Capacitance  
Test Input Capacitance  
Test Output Capacitance  
Test Clock Capacitance  
Input Leakage Current  
Output Leakage Current  
Input High Leakage Current  
Input Low Leakage Current  
15  
15  
20  
15  
±15  
±15  
200  
- 400  
0<VIN <VIL, VIH < VIN <VCC3(1)  
0<VIN <VIL, VIH < VIN <VCC3(1)  
VIN = VCC3 - 0.4V (3)  
ILO  
IIH  
IIL  
VIN = 0.4V (2,5)  
NOTES:  
1.  
2.  
3.  
4.  
5.  
This parameter is for inputs/outputs without an internal pull up or pull down.  
This parameter is for inputs with an internal pull up.  
This parameter is for inputs with an internal pull down.  
Guaranteed by design.  
This specification applies to the HITM# pin when it is driven as an input (e.g., in JTAG mode).  
4.3.2.  
DECOUPLING RECOMMENDATIONS  
4.3.  
AC Specifications  
Liberal decoupling capacitance should be placed  
near the processor. The processor’s large address  
and data buses can cause transient power surges,  
particularly when driving large capacitive loads.  
The AC specifications of the mobile Pentium  
processor with MMX technology on 0.25 Micron  
consist of setup times, hold times, and valid delays  
at 0 pF.  
Low inductance capacitors and interconnects are  
recommended for best high frequency electrical  
performance. Inductance can be reduced by  
shortening circuit board traces between the  
processor and decoupling capacitors as much as  
possible. These capacitors should be evenly  
distributed around each component on the power  
plane. Capacitor values should be chosen to  
ensure they eliminate both low and high frequency  
noise components.  
4.3.1.  
POWER AND GROUND  
For clean on-chip power distribution, the TCP has  
37 VCC2 (core power), 42 VCC3 (I/O power) and 72  
VSS (ground) inputs. Power and ground connections  
must be made to all external VCC2, VCC3 and VSS  
pins. On the circuit board all VCC2 pins must be  
connected to a 1.8V (166/200/233 MHz) or 2.0V  
(266 MHz) VCC2 plane (or island) and all VCC3 pins  
must be connected to a 2.5V VCC3 plane. All VSS  
pins must be connected to a VSS plane. Please  
refer to Table 2 for the list of VCC2, VCC3 and VSS  
pins.  
Power transients also occur as the processor  
rapidly transitions from  
a
low level power  
consumption to a high level one (or high to low  
power transition). A typical example would be  
entering or exiting the Stop Grant state. Another  
example would be executing a HALT instruction,  
causing the processor to enter the Auto HALT  
34  
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