®
MOBILE PENTIUM PROCESSOR WITH MMX™ TECHNOLOGY
CONTENTS
PAGE
PAGE
3.7. Pin Grouping According to Function ..........30
1.0. INTRODUCTION ............................................ 4
4.0. ELECTRICAL SPECIFICATIONS ................31
4.1. Maximum Ratings .....................................31
4.2. DC Specifications ......................................31
4.2.1. POWER SEQUENCING .....................31
4.3. AC Specifications ......................................34
4.3.1. POWER AND GROUND ....................34
4.3.2. DECOUPLING RECOMMENDATION 34
4.3.3. CONNECTION SPECIFICATIONS .....35
4.3.4. AC TIMINGS FOR A 66-MHZ BUS ....35
4.4. I/O Buffer Models ......................................46
4.4.1. BUFFER MODEL PARAMETERS ......49
4.4.2. SIGNAL QUALITY SPECIFICATION ..51
2.0. MICROPROCESSOR ARCHITECTURE
OVERVIEW .................................................... 4
®
2.1. Mobile Pentium Processor Family
Architecture ................................................ 5
®
2.2. Mobile Pentium Processor with MMX TM
Technology ................................................. 7
2.2.1. Full support for Intel MMX TM
technology ........................................... 7
2.2.2. Doubled code and data caches to 16K
each..................................................... 7
2.2.3. Improved branch prediction .................. 7
2.2.4. Enhanced pipeline................................ 8
2.3 0.25 Micron Technology.…………………..8
4.4.3. CLOCK SIGNAL MEASUREMENT
METHODOLOGY...............................55
®
3.0. MOBILE PENTIUM PROCESSOR WITH
MMX™ TECHNOLOGY PINOUT ................... 8
3.1. Mobile Differences from Desktop ................ 8
3.2. TCP Pinout and Pin Descriptions ................ 9
5.0. MECHANICAL SPECIFICATIONS ...............57
5.1. TCP Mechanical Diagrams .......................58
®
3.2.1. TCP MOBILE PENTIUM
6.0. THERMAL SPECIFICATIONS .....................64
6.1. Measuring Thermal Values for TCP ..........64
6.1.1. TCP Thermal Equations .....................64
6.1.2. TCP Thermal Characteristics .............64
6.1.3. TCP PC Board Enhancements ...........64
PROCESSOR WITH MMX™
TECHNOLOGY PINOUT ..................... 9
®
3.2.2. TCP MOBILE PENTIUM
PROCESSOR WITH MMX™
TECHNOLOGY PIN CROSS
REFERENCE..................................... 10
6.1.3.1. TCP STANDARD TEST BOARD
CONFIGURATION .............................65
3.3. Design Notes ............................................ 17
3.4. Quick Pin Reference ................................. 17
3.5. Bus Frequency ......................................... 26
3.6. Pin Reference Tables ............................... 27
3
INTEL [ INTEL ]
