Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
also recommended that the air temperature entering the fan be kept below 45 degrees C. Again,
meeting the processor’s temperature specification is the responsibility of the system integrator. The
processor temperature specification is found in Section 4.1 of this document.
Figure 32. Thermal Airspace Requirement for all Boxed Processor Fan Heatsinks in the
PGA370 Socket
Measure ambient temperature
0.3 inches above center of fan inlet
0.20 inches min.
0.20 inches
air space
min. air space
Fan Heatsink
Processor PGA-370
Socket
6.2.2
Boxed Processor Thermal Cooling Solution Clip
The boxed processor thermal solution requires installation by a system integrator to secure the
thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.
Motherboards designed for use by system integrators should take care to consider the implications
of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket
attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach
tabs in a way that interferes with the installation of the boxed processor thermal cooling solution
Figure 24 and Figure 25 show the REQUIRED keepout dimensions for the boxed processor
thermal solution.
6.3
Electrical Requirements for the Boxed Processor
6.3.1
Electrical Requirements
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable is attached
to the fan and will draw power from a power header on the motherboard. The power cable
connector and pinout are shown in Figure 33. Motherboards must provide a matched power header
to support the boxed processor. Table 38 contains specifications for the input and output signals at
the fan heatsink connector. The fan heatsink outputs a SENSE signal (an open-collector output)
that pulses at a rate of two pulses per fan revolution. A motherboard pull-up resistor provides VOH
to match the motherboard-mounted fan speed monitor requirements, if applicable. Use of the
SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to
GND.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the motherboard
documentation or on the motherboard. Figure 34 shows the recommended location of the fan
power connector relative to the PGA370 socket. The motherboard power header should be
positioned within 4.00 inches (lateral) of the fan power connector for the FC-PGA2 package.
Datasheet
71
INTEL [ INTEL ]
