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298596-004 参数 Datasheet PDF下载

298596-004图片预览
型号: 298596-004
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内容描述: 英特尔赛扬处理器的PGA370插槽高达1.40 GHz的0.13微米工艺 [Intel Celeron Processor for the PGA370 Socket up to 1.40 GHz on 0.13 Micron Process]
分类和应用:
文件页数/大小: 82 页 / 1417 K
品牌: INTEL [ INTEL ]
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Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process  
also recommended that the air temperature entering the fan be kept below 45 degrees C. Again,  
meeting the processor’s temperature specification is the responsibility of the system integrator. The  
processor temperature specification is found in Section 4.1 of this document.  
Figure 32. Thermal Airspace Requirement for all Boxed Processor Fan Heatsinks in the  
PGA370 Socket  
Measure ambient temperature  
0.3 inches above center of fan inlet  
0.20 inches min.  
0.20 inches  
air space  
min. air space  
Fan Heatsink  
Processor PGA-370  
Socket  
6.2.2  
Boxed Processor Thermal Cooling Solution Clip  
The boxed processor thermal solution requires installation by a system integrator to secure the  
thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.  
Motherboards designed for use by system integrators should take care to consider the implications  
of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket  
attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach  
tabs in a way that interferes with the installation of the boxed processor thermal cooling solution  
Figure 24 and Figure 25 show the REQUIRED keepout dimensions for the boxed processor  
thermal solution.  
6.3  
Electrical Requirements for the Boxed Processor  
6.3.1  
Electrical Requirements  
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable is attached  
to the fan and will draw power from a power header on the motherboard. The power cable  
connector and pinout are shown in Figure 33. Motherboards must provide a matched power header  
to support the boxed processor. Table 38 contains specifications for the input and output signals at  
the fan heatsink connector. The fan heatsink outputs a SENSE signal (an open-collector output)  
that pulses at a rate of two pulses per fan revolution. A motherboard pull-up resistor provides VOH  
to match the motherboard-mounted fan speed monitor requirements, if applicable. Use of the  
SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to  
GND.  
The power header on the baseboard must be positioned to allow the fan heatsink power cable to  
reach it. The power header identification and location should be documented in the motherboard  
documentation or on the motherboard. Figure 34 shows the recommended location of the fan  
power connector relative to the PGA370 socket. The motherboard power header should be  
positioned within 4.00 inches (lateral) of the fan power connector for the FC-PGA2 package.  
Datasheet  
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