Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
The dimensions for the boxed processor with the integrated fan heatsink are shown in Figure 30.
All dimensions are in inches.
The processor uses a new technology termed FC-PGA2. The FC-PGA2 package leverages the
previous FC-PGA package technology used on processors based on the 0.18 micron process. The
FC-PGA2 package adds an Integrated Heat Spreader (IHS) to improve heat conduction from the
processor die. This new solution prevent the need for exotic thermal solutions in the higher power
density processors. See section 5.0 of this document for the mechanical specifications of the
PGA370 socket.
Section 5.2 of this document also shows the recommended mechanical keepout zones for the boxed
processor fan heatink assembly. Figure 24 and Figure 25 show the REQUIRED keepout
dimensions for the boxed processor thermal solution. The cooling fin orientation on the heatsink
relative to the PGA370 socket is subject to change. Contact your local Intel Sales Representative
for documentation specific to the boxed fan heatsink orientation relative to the PGA370 socket.
Figure 31 shows the changes to the package mechanicals between the FC-PGA and FC-PGA2
designs. Note that the boxed fan heatsinks and associated clips are not compatible with earlier
boxed fan heatsinks for processors based on the 0.18 micron process.
Figure 29. Comparison between FC-PGA and FC-PGA2 package
FC-PGA2
FC-PGA
3.5 mm
3.2 mm
1.9 mm
3.2 mm
49.5 mm square
49.5 mm square
Figure 30. Side View of Space Requirements for the Boxed Processor
3.11
2.65
1.89
1.89
1.76
3.17
Datasheet
69
INTEL [ INTEL ]
