Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
6.0
Boxed Processor Specifications
The processor for the PGA370 socket is also offered as an Intel boxed processor. Intel boxed
processors are intended for system integrators who build systems from motherboards and standard
components. The boxed processor will be supplied with an unattached fan heatsink.
This section documents motherboard and system requirements for the fan heatsink that will be
supplied with the boxed processor. This section is particularly important for OEMs that
manufacture motherboards for system integrators. Unless otherwise noted, all figures in this
section are dimensioned in inches. Figure 28 shows a mechanical representation of the boxed Intel
processor in the Flip Chip Pin Grid Array 2 (FC-PGA2) package.
Note: Drawings in this section reflect only the specifications on the Intel Boxed Processor product. These
dimensions should not be used as a generic keep-out zone for all heatsinks. It is the system
designer’s responsibility to consider their proprietary solution when designing to the required keep-
out zone on their system platform and chassis. Refer to the Intel® Pentium® III processor Thermal/
Mechanical Functional Specification for further guidance. Contact your local Intel Sales
Representative for this document.
Figure 28. Conceptual Boxed Processor for the PGA370 Socket
Fan
Heatsink Clip
Heatsink
6.1
Mechanical Specifications
6.1.1
Mechanical Specifications for the FC-PGA2 Package
This section documents the mechanical specifications of the boxed processor fan heatsink in the
FC-PGA2 Package. The boxed processor in the FC-PGA2 Package ships with an un-attached fan
heatsink. Figure 28 shows a mechanical representation of the boxed processor for the PGA370
socket in the Flip Chip Pin Grid Array 2 (FC-PGA2) package.
The boxed processor fan heatsink is also asymmetrical in that the mechanical step feature,
Figure 31, must sit over the socket’s cam. The step allows the heatsink to securely interface with
the processor in order to meet the processor’s thermal requirements.
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Datasheet
INTEL [ INTEL ]
