Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
Table 38. Boxed Processor Fan Heatsink Spatial Dimensions
Dimensions (Inches)
Fan Heatsink Length
Min
Typ
Max
Units
3.14
1.81
2.6
Inches
Inches
Inches
Inches
Inches
Fan Heatsink Height
Fan Heatsink Width
Fan Heatsink height above motherboard
Air Keepout Zones from end of Fan Heatsink
0.29
0.20
0.30
0.33
Figure 31. Dimensions of Mechanical Step Feature in Heatsink Base
0.043
0.472
Units = inches
6.1.2
Boxed Processor Heatsink Weight
The boxed processor thermal cooling solution will not weigh more than 180 grams.
6.2
Thermal Specifications
This section describes the cooling requirements of the thermal cooling solution utilized by the
boxed processor.
6.2.1
Boxed Processor Cooling Requirements
The boxed processor is directly cooled with a fan heatsink. However, meeting the processor’s
temperature specification is also a function of the thermal design of the entire system and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Section 4.1 of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see Table 30 in Section 4.1) in chassis that provide
good thermal management.
For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life. Figure 32 illustrate an acceptable airspace clearance for the fan heatsink. It is
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Datasheet
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