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    298596-004 参数 Datasheet PDF下载

    298596-004图片预览
    型号： 298596-004
    PDF下载： 下载PDF文件 查看货源
    内容描述： 英特尔赛扬处理器的PGA370插槽高达1.40 GHz的0.13微米工艺 [Intel Celeron Processor for the PGA370 Socket up to 1.40 GHz on 0.13 Micron Process]
    分类和应用：
    文件页数/大小： 82 页 / 1417 K
    品牌： INTEL [ INTEL CORPORATION ]
     浏览型号298596-004的Datasheet PDF文件第2页浏览型号298596-004的Datasheet PDF文件第3页浏览型号298596-004的Datasheet PDF文件第4页浏览型号298596-004的Datasheet PDF文件第5页浏览型号298596-004的Datasheet PDF文件第7页浏览型号298596-004的Datasheet PDF文件第8页浏览型号298596-004的Datasheet PDF文件第9页浏览型号298596-004的Datasheet PDF文件第10页  
    Intel
    ®
    Celeron
    ®
    Processor for PGA370 up to 1.40 GHz on 0.13
    µ
    Process
    List of Tables
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    Processor Identification....................................................................................... 11
    System Bus Clock in Deep Sleep Mode (Differential Mode only) ....................... 16
    Voltage Identification Definition .......................................................................... 20
    System Bus Signal Groups ................................................................................ 23
    Frequency Select Truth Table for BSEL[1:0] ...................................................... 24
    Absolute Maximum Ratings ................................................................................ 25
    Voltage and Current Specifications..................................................................... 26
    Power Supply Current Slew Rate (dIcccore/dt)................................................... 27
    Vcc Static & Transient Tolerance........................................................................ 28
    AGTL Signal Group Levels Specifications .......................................................... 29
    Non-AGTL Signal Group Levels Specifications .................................................. 29
    3.3 Volt CMOS Output Signal Group DC Specifications ..................................... 30
    Processor AGTL Bus Specifications ................................................................... 30
    System Bus Timing Specifications (Single-Ended Clock) ................................... 31
    System Bus Timing Specifications (Differential Clock) ....................................... 32
    Valid System Bus to Core Frequency Ratios ..................................................... 33
    System Bus Timing Specifications (AGTL Signal Group) ................................... 33
    System Bus Timing Specifications (CMOS Signal Group) .................................. 33
    System Bus Timing Specifications (Reset Conditions) ...................................... 34
    System Bus Timing Specifications (APIC Clock and APIC I/O) .......................... 34
    System Bus Timing Specifications (TAP Connection) ........................................ 35
    Platform Power-On Timings ................................................................................ 36
    BCLK (Single-Ended Clock Mode) Signal Quality Specifications for
    Simulation at the Processor Pins ........................................................................ 41
    BCLK/BCLK# (Differential Clock Mode) and PICCLK Signal Quality
    Specifications for Simulation at the Processor Pins............................................ 41
    AGTL Signal Groups Ringback Tolerance Specifications at the
    Processor Pins .................................................................................................... 42
    Example Platform Information............................................................................. 45
    100 MHz AGTL Signal Group Overshoot/Undershoot Tolerance ...................... 46
    33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance........................ 48
    Signal Ringback Specifications for Non-AGTL Signal Simulation at the
    Processor Pins .................................................................................................... 49
    Processor Thermal Design Power ..................................................................... 51
    THERMTRIP# Time Requirement....................................................................... 51
    Thermal Diode Parameters ................................................................................. 52
    Thermal Diode Interface...................................................................................... 52
    The Processor Package Dimensions .................................................................. 54
    Processor Case Loading Parameters ................................................................. 54
    Signal Listing in Order by Signal Name .............................................................. 58
    Signal Listing in Order by Pin Number ................................................................ 63
    Boxed Processor Fan Heatsink Spatial Dimensions........................................... 70
    Fan Heatsink Power and Signal Specifications................................................... 72
    Signal Description ............................................................................................... 73
    Output Signals..................................................................................................... 80
    Input Signals ....................................................................................................... 80
    Input/Output Signals (Single Driver).................................................................... 81
    Input/Output Signals (Multiple Driver) ................................................................. 82
    6
    Datasheet

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