Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
1.1
Terminology
In this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low level. For
example, when FLUSH# is low, a flush has been requested. When NMI is high, a nonmaskable
interrupt has occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal
is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to
a hex ‘A’ (H= High logic level, L= Low logic level).
The term “system bus” refers to the interface between the processor, system core logic (a.k.a. the
chipset components), and other bus agents.
1.1.1
Package and Processor Terminology
The following terms are used often in this document and are explained here for clarification:
• The processor - The entire product including all internal components.
• 256k UP processor - The desktop version of the 0.13 micron process processor. Contains
256KB of L2 cache and is uni-processor capable only.
• PGA370 socket - 370-pin Zero Insertion Force (ZIF) socket which a FC-PGA packaged
processor plugs into.
• FC-PGA - Flip Chip Pin Grid Array. The package technology used on processors based on the
0.18 micron process for the PGA370 socket. The FC-PGA package has the processor die
exposed.
• FC-PGA2 - Flip Chip Pin Grid Array 2. The package technology used on the processor for the
PGA370 socket. The FC-PGA2 package contains an Integrated Heat Spreader which covers
the processor die.
• Advanced Transfer Cache (ATC) - L2 cache architecture used on the Celeron® processors.
ATC consists of microarchitectural improvements that provide a higher data bandwidth
interface into the processor core that is completely scaleable with the processor core
frequency.
• Keep-out zone - The area on or near a FC-PGA packaged processor that system designs can
not utilize.
• Keep-in zone - The area of a FC-PGA packaged processor that thermal solutions may utilize.
• Processor - For this document, the term processor is the generic form of the Celeron®
processor based on 0.13 micron process core for the PGA370 socket in the FC-PGA2 package.
• Processor core - The processor’s execution engine.
• Integrated Heat Spreader (IHS) - The Integrated Heat Spreader (IHS) is a metal cover on the
die and it is an integral part of the processor. The IHS promotes heat spreading away from the
die backside to ease thermal constraints.
The cache and L2 cache are industry designated names.
10
Datasheet
INTEL [ INTEL ]
