Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
3.4
VTT_PWRGD Signal Quality Specification.........................................................49
3.4.1 Transition region ....................................................................................49
3.4.2 Transition time........................................................................................50
3.4.3 Noise......................................................................................................50
4.0
5.0
6.0
Thermal Specifications and Design Considerations.........................................................51
4.1
Thermal Specifications........................................................................................51
4.1.1 THERMTRIP# Requirement...................................................................51
4.1.2 Thermal Diode........................................................................................52
Thermal Metrology ..............................................................................................52
4.2
Mechanical Specifications................................................................................................53
5.1
5.2
5.3
5.4
FC-PGA2 Mechanical Specifications ..................................................................53
Recommended Mechanical Keep-Out Zones .....................................................55
Processor Markings ............................................................................................56
Processor Signal Listing......................................................................................57
Boxed Processor Specifications.......................................................................................68
6.1
6.2
6.3
Mechanical Specifications...................................................................................68
6.1.1 Mechanical Specifications for the FC-PGA2 Package ...........................68
6.1.2 Boxed Processor Heatsink Weight.........................................................70
Thermal Specifications........................................................................................70
6.2.1 Boxed Processor Cooling Requirements ...............................................70
6.2.2 Boxed Processor Thermal Cooling Solution Clip ...................................71
Electrical Requirements for the Boxed Processor...............................................71
6.3.1 Electrical Requirements .........................................................................71
7.0
Processor Signal Description...........................................................................................73
7.1
7.2
Alphabetical Signals Reference ..........................................................................73
Signal Summaries...............................................................................................80
4
Datasheet
INTEL [ INTEL ]
