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28F800F3 参数 Datasheet PDF下载

28F800F3图片预览
型号: 28F800F3
PDF下载: 下载PDF文件 查看货源
内容描述: FAST BOOT BLOCK闪存系列8位和16 MBIT [FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT]
分类和应用: 闪存
文件页数/大小: 47 页 / 274 K
品牌: INTEL [ INTEL ]
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FAST BOOT BLOCK DATASHEET  
E
Read operations from the parameter blocks,  
identifier codes and status register transpire as  
single asynchronous or synchronous read cycles.  
The read configuration register setting determines  
whether or not read operations are asynchronous or  
synchronous.  
3.0 PRINCIPLES OF OPERATION  
The Fast Boot Block flash memory components  
include an on-chip WSM to manage block erase  
and program. It allows for CMOS-level control  
inputs, fixed power supplies, and minimal processor  
overhead with RAM-like interface timings.  
For all read operations, CE# must be driven active  
to enable the devices, ADV# must be driven low to  
open the internal address latch, and OE# must be  
driven low to activate the outputs. In asynchronous  
mode, the address is latched when ADV# is driven  
high. In synchronous mode, the address is latched  
by ADV# going high or ADV# low in conjunction  
with a rising (falling) clock edge, whichever occurs  
first. WE# must be at VIH. Figures 14 through 19  
illustrate different read cycles.  
3.1  
Bus Operations  
All bus cycles to and from flash memory conform to  
standard microprocessor bus cycles.  
3.1.1  
READ  
The flash memory has three read modes available:  
read array, identifier codes, and status register.  
These modes are accessible independent of the  
VPP voltage. The appropriate read command (Read  
Array, Read Identifier Codes, or Read Status  
Register) must be written to the CUI to enter the  
requested read mode. Upon initial power-up or exit  
from reset, the device defaults to read array mode.  
3.1.2  
OUTPUT DISABLE  
With OE# at a logic-high level (VIH), the device  
outputs are disabled. Output pins DQ0–DQ15 are  
placed in a high-impedance state.  
3.1.3  
STANDBY  
When reading information from main blocks in read  
array mode, the device supports two high-  
performance read configurations: asynchronous  
Deselecting the device by bringing CE# to a logic-  
high level (VIH) places the device in standby mode,  
which substantially reduces device power  
consumption. In standby, outputs are placed in a  
high-impedance state independent of OE#. If  
deselected during program or erase operation, the  
device continues to consume active power until the  
program or erase operation is complete.  
page-mode  
and  
synchronous  
burst-mode.  
Asynchronous page-mode is the default state and  
provides high data transfer rate for non-clocked  
memory subsystems. In this state, data is internally  
read and stored in a high-speed page buffer. A1:0  
addresses data in the page buffer. The page size is  
four words. The other read configuration,  
synchronous burst-mode, is enabled by writing to  
read configuration register. This register sets the  
read configuration, burst order, frequency  
configuration, and burst length. In synchronous  
burst-mode, the device latches the initial address  
then outputs a sequence of data with respect to the  
input CLK and read configuration setting.  
3.1.4  
WRITE  
Commands are written to the CUI using standard  
microprocessor write timings when ADV#, WE#,  
and CE# are active and OE# inactive. The CUI  
does not occupy an addressable memory location.  
The address is latched on the rising edge of ADV#,  
WE#, or CE# (whichever occurs first) and data  
needed to execute a command is latched on the  
rising edge of WE# or CE# (whichever goes high  
first). Write operations are asynchronous.  
Therefore, CLK is ignored during write operations.  
Figure 20 illustrates a write operation.  
12  
PRODUCT PREVIEW