E
SMART 3 ADVANCED BOOT BLOCK
1
2
3
4
5
6
7
8
16M
A
B
C
D
E
F
A13
A11
A8
VPP
WP#
A19
A7
A4
8M
A14
A10
A12
D14
D15
D7
WE#
A9
RP#
A18
A20
D2
A17
A5
A3
A2
A1
32M
A15
A6
A16
D5
D11
D12
D4
D8
CE#
D0
A0
VCCQ
GND
D6
D3
D9
GND
OE#
D13
VCC
D10
D1
0580_03
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the
upgrade address for the 32-Mbit device.
2.
4-Mbit density not available in µBGA* CSP.
Figure 4. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
9
PRELIMINARY
INTEL [ INTEL ]
