SMART 3 ADVANCED BOOT BLOCK
E
1
2
3
4
5
6
7
8
16M
A
B
C
D
E
F
A14
A12
A8
VPP
WP#
A20
A7
A4
8M
A15
A10
A13
NC
A11
D7
WE#
A9
RP#
A19
A21
D2
A18
A5
A3
A2
A1
A0
32M
A16
A6
A17
D5
NC
NC
D4
NC
NC
NC
CE#
D0
VCCQ
GND
D6
D3
GND
OE#
NC
VCC
D1
0580_04
NOTE:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the
upgrade address for the 32-Mbit device.
2.
4-Mbit density not available in µBGA* CSP.
Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
8
PRELIMINARY
INTEL [ INTEL ]
