OPTIREG™ SBC TLE9274QXV33
General product characteristics
4.3
Thermal resistance
Table 4
Thermal resistance1)
Symbol
Parameter
Values
Typ.
6
Unit Note or
Test Condition
Number
Min.
Max.
Junction to soldering point RthJSP
Junction to ambient RthJA
–
–
–
–
K/W Exposed Pad
P_4.3.1
P_4.3.2
2)
33
K/W
1) Not subject to production test, specified by design.
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5 W. Board: 76.2 x 114.3 x 1.5 mm3
with 2 inner copper layers (35 µm thick), with a thermal via array under the exposed pad contacting the first inner
copper layer and 300 mm2 cooling area on the bottom layer (70 µm). For more details, refer to Chapter 15.4.
Datasheet
15
Rev.2.0
2022-05-06