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TLE9274QX V33 参数 Datasheet PDF下载

TLE9274QX V33图片预览
型号: TLE9274QX V33
PDF下载: 下载PDF文件 查看货源
内容描述: [The device is designed forvarious CAN-LIN automotive applications as the main supply forthe microcontroller and as the interface for LIN and CAN bus networks.]
分类和应用:
文件页数/大小: 130 页 / 4267 K
品牌: INFINEON [ Infineon ]
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OPTIREG™ SBC TLE9274QXV33  
General product characteristics  
4.3  
Thermal resistance  
Table 4  
Thermal resistance1)  
Symbol  
Parameter  
Values  
Typ.  
6
Unit Note or  
Test Condition  
Number  
Min.  
Max.  
Junction to soldering point RthJSP  
Junction to ambient RthJA  
K/W Exposed Pad  
P_4.3.1  
P_4.3.2  
2)  
33  
K/W  
1) Not subject to production test, specified by design.  
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5 W. Board: 76.2 x 114.3 x 1.5 mm3  
with 2 inner copper layers (35 µm thick), with a thermal via array under the exposed pad contacting the first inner  
copper layer and 300 mm2 cooling area on the bottom layer (70 µm). For more details, refer to Chapter 15.4.  
Datasheet  
15  
Rev.2.0  
2022-05-06  
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