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TLE9263QX 参数 Datasheet PDF下载

TLE9263QX图片预览
型号: TLE9263QX
PDF下载: 下载PDF文件 查看货源
内容描述: [The device is designed for various CAN-LIN automotive applications as main supply for the microcontroller and as interface for a LIN and CAN bus network.]
分类和应用:
文件页数/大小: 164 页 / 6311 K
品牌: INFINEON [ Infineon ]
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TLE9263QX  
Pin Configuration  
Pin  
Symbol  
Function  
31  
INT  
Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal  
Mode and for indicating failures. Active low.  
During start-up used to set the SBC configuration. External pull-up sets config 1/3,  
no external pull-up sets config 2/4.  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
RO  
Reset Output  
TXDLIN1  
RXDLIN1  
TXDCAN  
RXDCAN  
VCAN  
GND  
Transmit LIN1  
Receive LIN1  
Transmit CAN  
Receive CAN  
Supply Input; for internal HS-CAN cell  
GND  
CANL  
CAN Low Bus Pin  
CAN High Bus Pin  
not connected; internally not bonded.  
CANH  
n.c.  
LIN1  
LIN1 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN  
specification 2.2 as well as SAE J2602-2.  
43  
44  
GND  
LIN2  
Ground  
LIN2 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN  
specification 2.2 as well as SAE J2602-2.  
45  
46  
47  
n.c.  
n.c.  
FO2  
not connected; internally not bonded.  
not connected; internally not bonded.  
Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;  
Open drain. Active LOW.  
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by  
VSHS (default is FO2, see also Chapter 14.1.1)  
48  
FO3/TEST  
Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;  
Open drain. Active LOW  
TEST; Connect to GND to activate SBC Software Development Mode;  
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for  
normal operation.  
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by  
VSHS (default is FO3, see also Chapter 14.1.1)  
Cooling GND  
Tab  
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an  
electrical ground.1)  
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The  
exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND  
(recommended) for the best EMC performance.  
Note:all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;  
all GND pins as well as the Cooling Tab must be connected to one common GND potential;  
Data Sheet  
10  
Rev. 1.1, 2014-09-26  
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