TC1796
Package and Reliability
5
Package and Reliability
5.1
Package Parameters (P/PG-BGA-416-4)
Table 35
Thermal Characteristics of the Package
Parameter
Symbol
Values
Typ.
Unit Note /
Test Condi
Min.
Max.
tion
Thermal resistance junction RTJCT CC –
8
K/W –
K/W –
case top1)
Thermal resistance junction RTJCB CC –
15
case bottom1)
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are under
user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA
can be obtained from the upper four partial thermal resistances.
Data Sheet
130
V1.0, 2008-04
INFINEON [ Infineon ]
