TC39x BC/BD-Step
Electrical SpecificationPower Supply Current
4) A single DS channel instance consumes 4 mA.
5) EVADC current is limited to 3mA in "ADAS power pattern with 2 EVADC" at (IDDM).
6) A single VADC unit consumes 1.3 mA.
7) If SCR ADCOMP is activated, an additional 0.6 mA adder is to be considered.
8) Limits are defined for real power pattern (VDD=1.275V). For max power pattern limit has to be multiplied by the factor 1.22.
Table 3-29 Module Core Current Consumption
Parameter
Symbol
Values
Typ.
Unit
Note / Test Condition
Min.
Max.
I
DD core current of CPUx main
I
I
DDCx0 CC
-
-
-
-
-
70
mA
mA
mA
mA
max power pattern;
IPC=1.2
core with CPUx lockstep core
inactive
-
-
-
45
real power pattern;
IPC=0.6
I
DD core current of CPUx main
DDCxx CC
IDDCx0
50
+
+
max power pattern;
IPC=1.2
core with CPUx lockstep core
active
IDDCx0
40
real power pattern;
IPC=0.6
I
DD core current added by GTM IDDGTM CC
-
-
-
-
160
130
mA
mA
max power pattern
real power pattern;
TIMx, TOMx, ATOMx ,
MCSx active. 3 clusters
at 200 MHz.
-
-
60
mA
TIMx, TOMx active at
100MHz. ATOMx ,
MCSx, DPLL inactive. 2
clusters at 100 MHz.
I
I
DD core current added by HSM IDDHSM CC
DD core current added by SPU IDDSPU1 CC
-
-
-
-
20 1)
mA
mA
max power pattern;
HSM running at
100MHz.
360 2)
CTRL.DIV = 00; SPU
@ 300 MHz; FFT
length 2048;
DATSRC=EMEM;
complex windowing
I
I
DD core current added by SPU IDDSPU2 CC
-
-
-
-
310 2)
mA
mA
CTRL.DIV = 00; SPU
@ 300 MHz; FFT
length 512;
DATSRC=EMEM;
complex windowing
DD core dynamic current load
IDDSPULJ1
390 3)
CTRL.DIV = 00; SPU
@ 300 MHz; FFT
length 2048;
jump during IDDSPU1 pattern. CC
DATSRC=EMEM;
complex windowing
Data Sheet
451
V 1.2, 2021-03
OPEN MARKET VERSION
INFINEON [ Infineon ]
