Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
The board designer can choose between several types of thermal interfaces. Heat-sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Table 5-9. 750GX Thermal Interface and Adhesive Materials Vendors
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
(989) 496-4000
http://www.dowcorning.com/content/etronics
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
(781) 935-4850
http://www.chomerics.com
Thermagon, Inc.
4797 Detroit Avenue
Cleveland, OH 44102-2216
(216) 939-2300 / (888) 246-9050
http://www.thermagon.com
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
(860) 571-5100 / (800) 562-8483
http://www.loctite.com
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
(609) 799-9388
http://www.aitechnology.com
Section 5.8 provides a heat-sink selection example using one of the commercially available heat sinks.
5.8 Heat-Sink Selection Example
For preliminary heat-sink sizing, the die-junction temperature can be expressed as follows:
TJ = TA + TR + (θJC + θINT + θSA) × PD
where:
TJ is the die-junction temperature
TA is the inlet cabinet ambient temperature
TR is the air temperature rise within the system cabinet
θJC is the junction-to-case thermal resistance
θINT is the thermal resistance of the thermal interface material
θSA is the heat-sink-to-ambient thermal resistance
PD is the power dissipated by the device
750GX_ds_body.fm SA14-2765-02
September 2, 2005
System Design Information
Page 67 of 73
IBM [ IBM ]
