IBM25PPC604E3DB--250E 参数 Datasheet PDF下载

Table 10. Pinout Listing for the CBGA Package (Continued)

Signal Name

WT

VDD

VOLTDETGND

2

XATS

D02

F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06,

J08, J09, J11, K07, K10, L06, L08, L09, L11

F03

J16

Low

I/O

Pin Number

Active

Low

—

I/O

Output

—

Notes:

1. These are test signals for factory use only and must be pulled up to Vdd for normal machine operation.

2. NC (no-connect) in the 604; internally tied to GND in the 604e CBGA package to indicate to the power

supply that a low-voltage processor is present.

3. To operate in accordance with these specifications, the drive mode signals must be configured with

DRVMOD0 = high, and DRVMOD1 = high.

1.7 Package Description

The package parameters for the 604e are provided in the following list. The package type is 21 mm, 256-

lead ceramic ball grid array (CBGA).

Package outline

Interconnects

Pitch

Maximum module height

Ball diameter

21 x 21 mm

255

1.27 mm (50 mil)

3.30 mm

0.89 mm (35 mil)

9/17/99 Revision 1.4

PID9q-604e Hardware Datasheet

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

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