IBM25PPC604E3DB--250E 参数 Datasheet PDF下载

1.5 Pin Assignments

IBM both offer a ceramic ball grid array (CBGA) package. IBM CBGA packages have identical pinouts.

the side profile of the CBGA package to indicate the direction of the top surface view.

Part A

01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

Not to Scale

Part B

Substrate Assembly

Encapsulant

View

Die

Figure 9. Pinout of the CBGA Package as Viewed from the Top Surface

16

PID9q-604e Hardware Datasheet

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

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