PowerPC 440GP Embedded Processor Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device. None of the performance specification contained in this document are guaranteed
when operating at these maximum ratings.
Characteristic
Supply Voltage (Internal Logic)
Supply Voltage (I/O Interface, except DDR SDRAM)
PLL Supply Voltages
Symbol
Value
Unit
Notes
VDD
0 to +1.95
0 to +3.6
0 to +1.95
0 to +2.7
0 to +3.6
0 to +5.5
-55 to +150
-40 to +120
V
1
1
2
OVDD
AxVDD
SVDD
VIN
V
V
Supply Voltage (DDR SDRAM Logic)
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
Case temperature under bias
Notes:
V
V
VIN
V
TSTG
TC
°C
°C
3
1. If OVDD ≤ 0.4V, it is required that VDD ≤ 0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms
duration during each power up or power down event.
2. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
PPC440GP. A separate filter, as shown below, is recommended for each voltage:
AxVDD
VDD
L
L – SMT ferrite bead chip, Murata BLM31A700S
C
C – 0.1µF ceramic
3. This value is not a specification of the operational temperature range, it is a stress rating only.
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
<0.1
1.2
100 (0.51) 200 (1.02)
Ceramic
Plastic
<0.1
1.2
<0.1
1.2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
Junction-to-case thermal resistance
θJC
θCA
θJB
1, 3
2
Ceramic
Plastic
18.9
17.7
20.8
16.3
Case-to-ambient thermal resistance (w/o heat sink)
2, 3
Ceramic
Plastic
Junction-to-ball (typical)
8.0
3
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately
predict thermal performance in production equipment environments. The operational case temperature must be maintained.
3. Modeled on standard JEDEC 2S2P card, 50x50mm
Page 49 of 72
5/13/04
IBM [ IBM ]
