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IBM25PPC440GP-3FC400CZ 参数 Datasheet PDF下载

IBM25PPC440GP-3FC400CZ图片预览
型号: IBM25PPC440GP-3FC400CZ
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA552, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552]
分类和应用: 时钟外围集成电路
文件页数/大小: 72 页 / 1562 K
品牌: IBM [ IBM ]
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PowerPC 440GP Embedded Processor Data Sheet  
Heat Sink Mounting Information (Ceramic Package Only)  
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the  
heat sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks  
may be attached to the package by several methods: adhesive, spring clips to the printed-circuit board or  
package, or a mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing  
excessive mechanical stress on bonding of the chip to the substrate and the package to the board.  
Heat Sink Attached With Spring Clip  
Heat sink  
Heat sink  
Heat sink clip  
Heat sink clip  
Thermal grease  
Thermal grease  
CBGA  
CBGA  
package  
package  
Printed  
circuit  
board  
Printed  
circuit  
board  
Spring clip to package  
Spring clip to board  
1
Static compression (spring force)—2.27kg maximum  
Static compression (spring force)—2.27kg maximum  
Note 1: Force is limited by allowable compression on the die.  
Allowable package compression force is 4.4kg.  
Heat Sink Attached With Adhesive  
Heat sink  
Adhesive  
Printed  
circuit  
board  
CBGA  
CBGA  
package  
package  
Adhesive  
Printed  
circuit  
board  
Heat sink  
Weight  
force  
Weight  
force  
Heat sink weight force—60g maximum  
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account  
for the shock and vibration effects of any particular application.  
Page 50 of 72  
5/13/04  
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