8.7 Thermal Management Information
Th is section provides th erm al m an agem en t in form ation for th e CBGA package for air
cooled application s. Proper th erm al con trol design is prim arily depen den t u pon th e
system -level design ; th at is, th e h eat sin k, air flow an d th e th erm al in terface m aterial.
To redu ce th e die-ju n ction tem peratu re, h eat sin ks m ay be attach ed to th e package by
several m eth ods -- adh esive, sprin g clip to h oles in th e prin ted-circu it board or pack-
age, an d m ou n tin g clip an d screw assem bly; see Figu re 19 . Th is sprin g force sh ou ld
n ot exceed 5.5 pou n ds.
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
Figure 19. Package Exploded Cross-Sectional View with Several Heat Sink Options
Th e board design er can ch oose between several types of h eat sin ks to place on th e
PPC740 an d PPC750. Th ere are several com m ercially-available h eat sin ks provided by
th e followin g ven dors:
Ch ip Coolers, In c.
800-227-0254 (USA/ Can ada)
401-739-7600
333 Strawberry Field Rd.
Warwick, RI 02887-6979
Th erm alloy
2021 W. Valley View Lan e
P.O. Box 810839
Dallas, TX 75731
214-243-4321
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PPC740 and PPC750 Hardware Specifications
Preliminary and subject to change without notice
IBM [ IBM ]
